产品描述
CMI95M是一款为测试铜箔厚度设计的电池供电的手持式测厚仪，它能够在一秒钟之内测量印刷电路板上的铜箔厚度，范围从1/8到4.0盎司/平方英尺(5-140微米)。Measure copper foil thickness in less than a second CMI95M由工厂调校，不需要任何标准片。它使用方便，只需将产品所有的软探针放到铜箔的表面就可以看到关于铜箔厚度的指示。
仪器特点：
配置包括：CMI 95M、集成探头、一个9V电池、保护套/皮带夹、快速入门指南、1年保修
对于金属镀层测厚的解决方案、相关配件及耗材，牛津仪器提供范围的优质售前售后服务与技术支持。
Microresistance Microresistance Microresistance
CMI95M CMI165 CMI511 CMI563 CMI760 Technique Microresistance Eddy current Copper Foil ✔ ✔ X ✔ ✔ Copper Laminate ✔ ✔ X ✔ ✔ Copper - Surface X ✔ X ✔ ✔ Copper - Fine Line X ✔ X ✔ ✔ Copper Thru-hole X X ✔ X Optional Temperature Compensation X ✔ ✔ X ✔ (ETP Probe) Replacement Probe Tip N/A ✔ X ✔ ✔ (SRP-4 Probe) Unit Selection oz or µm mil or µm mil or µm mil or µm mil or µm Replacement Probe Tip ±1.0 mil + 5% ±1.0 mil + 5% ±1.0 mil + 5% ±1.0 mil + 5% ±1.0 mil + 5% Unit Selection 0.5 mil 0.01 mil 0.01 mil 0.01 mil 0.01 mil Thickness Range 8 indicator lights:
1/8-4 oz
5-140 µm Electroless Cu:
0.01-0.5 mil
0.25-12.7 µm
Electroplated Cu
0.1-10 mil
2-254 µm 0.08-4.0 mil
2-102 um Electroless Cu:
0.01-0.5 mil
0.25-12.7 µm
Electroplated Cu
0.1-6 mil
3-152 µm Surface Cu:
0.01-10 mil
0.25-254 µm
Thru-hole Cu:
0.05-4 mil
1-102 µm
